In Android before 2018-04-05 or earlier security patch level on Qualcomm Small Cell SoC, Snapdragon Mobile, and Snapdragon Wear FSM9055, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, and SDX20, potential stack-based buffer overflow exist in thermal service leading to root compromise.
The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.
Link | Tags |
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https://source.android.com/security/bulletin/2018-04-01 | vendor advisory |
http://www.securityfocus.com/bid/103671 | vdb entry third party advisory |