Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
The product performs operations on a memory buffer, but it reads from or writes to a memory location outside the buffer's intended boundary. This may result in read or write operations on unexpected memory locations that could be linked to other variables, data structures, or internal program data.
| Link | Tags |
|---|---|
| http://www.securityfocus.com/bid/92381 | vdb entry third party advisory |
| https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4 | mailing list third party advisory patch |
| https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063 | broken link |