CVE-2017-18323

Description

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

References

Link	Tags
https://www.qualcomm.com/company/product-security/bulletins	vendor advisory
http://www.securityfocus.com/bid/106128	third party advisory vdb entry

Frequently Asked Questions

What is the severity of CVE-2017-18323?: CVE-2017-18323 has been scored as a medium severity vulnerability.
How to fix CVE-2017-18323?: To fix CVE-2017-18323, make sure you are using an up-to-date version of the affected component(s) by checking the vendor release notes. As for now, there are no other specific guidelines available.
Is CVE-2017-18323 being actively exploited in the wild?: As for now, there are no information to confirm that CVE-2017-18323 is being actively exploited. According to its EPSS score, there is a ~0% probability that this vulnerability will be exploited by malicious actors in the next 30 days.
What software or system is affected by CVE-2017-18323?: CVE-2017-18323 affects Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear.

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Description

Category

CWE-320 – Key Management Errors

References

Frequently Asked Questions