CVE-2018-11264

Description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

Category

7.8
CVSS
Severity: High
CVSS 3.0 •
CVSS 2.0 •
EPSS 0.04%
Vendor Advisory qualcomm.com
Affected: Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Published at:
Updated at:

References

Link Tags
https://www.qualcomm.com/company/product-security/bulletins vendor advisory
http://www.securityfocus.com/bid/105838 third party advisory vdb entry

Frequently Asked Questions

What is the severity of CVE-2018-11264?
CVE-2018-11264 has been scored as a high severity vulnerability.
How to fix CVE-2018-11264?
To fix CVE-2018-11264, make sure you are using an up-to-date version of the affected component(s) by checking the vendor release notes. As for now, there are no other specific guidelines available.
Is CVE-2018-11264 being actively exploited in the wild?
As for now, there are no information to confirm that CVE-2018-11264 is being actively exploited. According to its EPSS score, there is a ~0% probability that this vulnerability will be exploited by malicious actors in the next 30 days.
What software or system is affected by CVE-2018-11264?
CVE-2018-11264 affects Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear.
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