CVE-2018-11277

Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Category

7.8
CVSS
Severity: High
CVSS 3.0 •
CVSS 2.0 •
EPSS 0.04%
Vendor Advisory qualcomm.com
Affected: Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Published at:
Updated at:

References

Frequently Asked Questions

What is the severity of CVE-2018-11277?
CVE-2018-11277 has been scored as a high severity vulnerability.
How to fix CVE-2018-11277?
To fix CVE-2018-11277, make sure you are using an up-to-date version of the affected component(s) by checking the vendor release notes. As for now, there are no other specific guidelines available.
Is CVE-2018-11277 being actively exploited in the wild?
As for now, there are no information to confirm that CVE-2018-11277 is being actively exploited. According to its EPSS score, there is a ~0% probability that this vulnerability will be exploited by malicious actors in the next 30 days.
What software or system is affected by CVE-2018-11277?
CVE-2018-11277 affects Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear.
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