CVE-2020-11154

Description

u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55

Category

8.8
CVSS
Severity: High
CVSS 3.1 •
CVSS 2.0 •
EPSS 0.08%
Vendor Advisory qualcomm.com
Affected: Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Published at:
Updated at:

References

Link Tags
https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin broken link
https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin vendor advisory

Frequently Asked Questions

What is the severity of CVE-2020-11154?
CVE-2020-11154 has been scored as a high severity vulnerability.
How to fix CVE-2020-11154?
To fix CVE-2020-11154, make sure you are using an up-to-date version of the affected component(s) by checking the vendor release notes. As for now, there are no other specific guidelines available.
Is CVE-2020-11154 being actively exploited in the wild?
As for now, there are no information to confirm that CVE-2020-11154 is being actively exploited. According to its EPSS score, there is a ~0% probability that this vulnerability will be exploited by malicious actors in the next 30 days.
What software or system is affected by CVE-2020-11154?
CVE-2020-11154 affects Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking.
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